Printed Circuits Board
Products
We offer solutions across a wide variety of applications in many sectors.
OUR MISSION
Utilization of the very best of materials, latest machinery and quality control not only enables the manufacture of more reliable products, but also a wider range of capabilities.
RIGID PCB
The range of PCB products has been developed to provide the best price/performance ratio and to cater to the demands of the majority of customers. The production utilizes a range of world competitive raw materials and cost effective processes to give customers a large variety of options while maintaining a high level of quality and tolerance control, all at world competitive prices.
FR4 1.60mm - 8 layer - 1oz, TG170 - Enig, Impedance control, Application Medical
ALUMINUM PCB
The Al PCB section is a production department for specialized metal laminate products. These products have passed UL certificate and are in accordance with IPC inspection standards.
They are extensively applied and used for ordinary LED light boards to sophisticated and industrially precise accessories, such as lights, third stop-lights, headlamps, fuse holders control units, air conditioning management.
​AL 1.6mm - 1 layer - 2oz - 2w/mk - HAL LF
HDI PCB High density interconnect
This range of PCB products has been developed to cater to high end PCB requirements, where product performance conformity and reliability are paramount and integral to the final application of the product. These PCBs are manufactured using the best of raw materials and state of the art machinery and equipment. Extensive inspection and quality control go hand in hand with this category.
FR4 1.20mm - 10 layer - Hoz, TG150- Blind /burried via hole, Enig + OSP, Application Computer
RIGID- Flex and FLEX PCB
Flex & Rigid-Flex circuits can be shaped to fit where no other design can. They are a hybrid of ordinary printed circuit boards and round wire, exhibiting benefits of each.
We also have multiple material substrates and adhesives to choose from, along with surface finishes and treatments. Stiffeners can also be added to reinforce selective areas of the flexible circuitry for component support durability and mounting.
Rigid: FR-4, 4 layer, thickness 1.6mm, Flex: Polyimide, double sided, thickness: 2 mil, Immersion Gold
Application Automotive
FR4
8 layer - 1.60mm - 1oz - TG 150
Impedance control - Enig
Application Computer
FR4
6 layer - 1.60mm - 1oz
Immersion Gold
Application Computer
FR4
12 layer - 1.20mm - 1oz - TG 170
ENIG - Blind, Buried vias, Copper Filled, Capped
Embedded
FR4
4 layer - 1.60mm - 2oz - TG 150
Immersion Silver
Application Telecomunication
FR4
14 layer - 1.60mm - 1oz - TG 170
ENIG - Blind, Buried vias, Copper Filled, Capped
Application Mobile
FR4 + Rogers
12 layer - 1.57mm - Hoz - TG 180
Blind via hole - Enig
Application Comunication Network
Flex pcb
Layers: SSB
Min. Width: 0.152mm, Min. Space: 0.166mm
Immersion Nickel/Gold
Application: Computer
FR4
4 layer - 1.60mm - 2oz
HAL LF
Application Automotive
IPC Class 3
PPAP - FMEA
FR4
6 layer - 1.60mm - 3oz - TG 150
Immersion Tin
Application Medical
FR4
10 layer - 1.60mm - 1oz
ENIG + HAL LF
Application Computer
SBU
Sequential Build Up. This technology is used to produce buried plated holes or very high tichness PCB. It consists in many different cycling press, spaced out by holes plating or copper filling.
BGA
Ball Grid Array. A surface mount chip package that uses a grid of solder balls as its connectors.
BGA (pitch & pad)"Pitch" value indicates the interaxis between 2 BGA pads and "pad" their dimension.
HDI
High Density Interconnections. HDI PCB is to define a PCB with a higher wiring density per unit area than a conventional PCB.