Printed Circuits Board
Production Capability
The development of our management system has proceeded through different stages in order to ensure efficient design and control. Every workflow was analyzed in order to determine which activities needed control and estimate specific risks for each activity. Based on the results we designed required routines.
The PCB cannot simply be bought off the shelf. If you are aware of the many stages required in the production of a PCB, you will know that it is indeed a long and complex process.
1.Filmwork 13.Etching
2.Material preparation 14.Quality Control
3.Mounting holes & pinning 15.Tin Strip
4.CNC drilling 16.Brushing / Copper plating
5.Brushing plating 17.Soldermask application
6.Electroless copper plating 18.Soldermask exposure
7.Brushing / resist 19.Soldermask development
8.Laminating resist 20.Burn in
9.Exposing resist 21.Hot Air Levelling
10.Developing resist 22.Pinning
11.Tin lead Plating 23.Routing
12.Drying 24.Final quality checks
HDI is the abbreviation for High Density Interconnector. HDI PCB is defined as a PCB with a higher wiring density per unit area than conventional PCB. They have finer lines and spaces, smaller vias and capture pads and higher connection pad density than employed in conventional PCB technology.
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. HDI PCB is the best alternative to high layer-countand expensive standard laminate or sequentially laminated boards.