Wellmind Printed Circuits Board
Production Capability
The development of our management system has proceeded through different stages in order to ensure efficient design and control. Every workflow was analyzed in order to determine which activities needed control and estimate specific risks for each activity. Based on the results we designed required routines.
The PCB cannot simply be bought off the shelf. If you are aware of the many stages required in the production of a PCB, you will know that it is indeed a long and complex process.
1.Filmwork 13.Etching
2.Material preparation 14.Quality Control
3.Mounting holes & pinning 15.Tin Strip
4.CNC drilling 16.Brushing / Copper plating
5.Brushing plating 17.Soldermask application
6.Electroless copper plating 18.Soldermask exposure
7.Brushing / resist 19.Soldermask development
8.Laminating resist 20.Burn in
9.Exposing resist 21.Hot Air Levelling
10.Developing resist 22.Pinning
11.Tin lead Plating 23.Routing
12.Drying 24.Final quality checks
HDI stands for High Density Interconnector, referring to a type of PCB that offers greater wiring density per unit area compared to traditional PCBs. These boards feature finer lines and spaces, smaller vias and capture pads, and a higher density of connection pads than standard PCB technology. HDI PCBs are designed to minimize size and weight while improving the electrical performance of devices. They are constructed using microvias, buried vias, and sequential lamination with insulating materials and conductive wiring for enhanced routing density. HDI PCBs serve as an excellent alternative high layer-count and costly standard laminate or sequentially laminated boards.